OTC 2018: TechnipFMC unveils Subsea 2.0 ‘product platform’

Offshore staff

HOUSTON – TechnipFMC is launching Subsea 2.0, a ‘product platform’ designed to make subsea projects simpler, leaner, and smarter at the Offshore Technology Conference at NRG Park in Houston.

In combination with iEPCI, the company’s integrated approach to field architecture and project execution, Subsea 2.0 should also improve project economics and deliver first oil and gas faster, TechnipFMC added.

The goal of iEPCI is to transform subsea projects through the full field development process by integrating front-end design and life of field to streamline project execution.

The new combination is intended to advance progress further by combining ‘expert’ teams to rethink how subsea production could be more efficient.

Subsea 2.0 comprises six core products that combine field-proven and new technologies. They include the compact tree, compact manifold, flexible jumpers, distribution, controls and horizontal connectors.

According to the company, the smaller, lighter products can a reduction of up to 50% in size, weight and part count, while maintaining the same or better functionality.

Subsea 2.0 is designed to accommodate iEPCI using LEAN product and process engineering, and the product platform has been standardized to be configurable to client needs and optimized to improve performance over the life of the field.

This should result in a 70-90% reduction in manual activities during the production process, the company claims, with faster hardware delivery times.

Subsea 2.0 has been incorporated into various current projects includingShell’s Kaikias subsea development in 4,575 ft (1,394 m) of water in the US Gulf of Mexico, a tieback to the Ursa tension-leg platform.

On March 4, TechnipFMC delivered and installed the first application of its compact pipeline end manifold and horizontal connection system technologies with flexible jumpers for this project.

Subsea 2.0 products are said to be compatible with tiebacks, brownfields and greenfield projects. Additional products are under development and will be added to the product platform.

TechnipFMC is exhibiting at booth #2038.

04/30/2018